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January 3, 2011
Thermally conductive silicone encapsulant designed for high-heat dissipation applications
Lord Corp. has announced the availability of a new thermally conductive silicone encapsulant. Designed for encapsulation applications in which high heat dissipation is required, SC-305 is a two-component silicone system. Suitable for LED... Read more...


March 5, 2010
Acrylic adhesive works on various substrates, including unprepared metals
Lord Corp. offers Maxlok™, a new acrylic adhesive developed to meet the need for a process-friendly adhesive that will work on various substrates, including unprepared metals. The adhesive is available in three cure speeds, each of which... Read more...