Dorner announces winner of 2019 Richard C. Ryan Packaging Education Scholarship

Jacob Gaspari

Hartland, Wis.-based Dorner Mfg. Corp. has named Jacob Gaspari, a student at Columbus Central Community College (Nebraska), the recipient of the 2019 Richard C. Ryan Packaging Education Scholarship.

This $2,000 scholarship is awarded to a student enrolled in a two- or four-year program at any partner school of PMMI, the Association for Packaging and Processing Technologies. The scholarship is named for the former president/CEO of Dorner, who was a member of the PMMI board of directors and encouraged lifelong learning.

Gaspari is pursuing a mechatronics degree. He is an electromechanical technician at Becton, Dickinson and Co. and was a wheeled vehicle technician in the Nebraska Army National Guard.